單面(mian)組裝：

來料檢測 => 絲(si)印焊(han)膏(gao)（點貼片(pian)膠）=> 貼片(pian) => 烘干（固化）=> 回(hui)流焊(han)接 =>清洗(xi) => 檢測 => 返修

雙(shuang)面組裝：

A：來料檢測 => PCB的A面(mian)絲(si)印(yin)(yin)焊(han)膏（點(dian)貼(tie)片(pian)膠）=> 貼(tie)片(pian) PCB的B面(mian)絲(si)印(yin)(yin)焊(han)膏（點(dian)貼(tie)片(pian)膠）=> 貼(tie)片(pian) =>烘干 => 回流焊(han)接（盡量僅對B面(mian) => 清洗(xi) => 檢測 => 返修）。

B：來料檢測 => PCB的A面絲印焊膏（點貼片膠）=> 貼片 => 烘干（固化）=>A面回流焊接 => 清洗 => 翻板 = PCB的B面點貼片膠 => 貼片 => 固化 =>B面波峰焊 => 清洗 => 檢測 => 返修） 上海貼片加工

此工藝適用于在PCB的A面回流焊，B面波峰焊。在PCB的B面組裝的SMD中，只有SOT或SOIC（28）引腳以下時，宜采用此工藝。 電子產品OEM代工

三、單面(mian)混裝工藝(yi)：

來料檢測 => PCB的A面絲印焊(han)(han)膏（點貼片膠）=> 貼片 =>烘干（固化(hua)）=>回流焊(han)(han)接(jie) => 清(qing)洗 => 插件 => 波峰焊(han)(han) => 清(qing)洗 => 檢測 => 返修(xiu)

四、雙面混裝工(gong)藝：

A：來料檢(jian)測(ce) =>PCB的B面(mian)點貼片膠 => 貼片 => 固化 => 翻板 => PCB的A面(mian)插件=> 波峰焊(han) => 清洗 => 檢(jian)測(ce) => 返(fan)修

先貼后插，適用于SMD元件多于分離(li)元件的情況

B：來料檢(jian)測(ce) => PCB的A面插件（引腳(jiao)打(da)彎）=> 翻(fan)(fan)板 => PCB的B面點貼片膠 =>貼片 => 固化 => 翻(fan)(fan)板 => 波峰焊(han) => 清(qing)洗 => 檢(jian)測(ce) => 返修

先插(cha)后貼，適用(yong)于分離元(yuan)件多于SMD元(yuan)件的情況

C：來(lai)料檢(jian)測 => PCB的(de)A面絲印焊(han)膏 => 貼(tie)(tie)片 => 烘干 => 回流焊(han)接 =>插件，引腳打(da)彎(wan) => 翻(fan)(fan)板 => PCB的(de)B面點(dian)貼(tie)(tie)片膠 => 貼(tie)(tie)片 => 固化 => 翻(fan)(fan)板 => 波(bo)峰焊(han) =>清洗 =>; 檢(jian)測 => 返修(xiu)A面混裝，B面貼(tie)(tie)裝。

D：來料(liao)檢(jian)(jian)(jian)測 =>PCB的B面(mian)(mian)點貼(tie)(tie)(tie)片(pian)(pian)(pian)(pian)膠(jiao) => 貼(tie)(tie)(tie)片(pian)(pian)(pian)(pian) => 固(gu)(gu)化(hua) => 翻(fan)板 =>PCB的A面(mian)(mian)絲(si)印(yin)(yin)焊(han)(han)(han)(han)膏(gao) => 貼(tie)(tie)(tie)片(pian)(pian)(pian)(pian) => A面(mian)(mian)回(hui)流(liu)(liu)焊(han)(han)(han)(han)接(jie)(jie) => 插件 => B面(mian)(mian)波(bo)峰焊(han)(han)(han)(han) => 清洗 => 檢(jian)(jian)(jian)測 =>返修A面(mian)(mian)混裝(zhuang)(zhuang)，B面(mian)(mian)貼(tie)(tie)(tie)裝(zhuang)(zhuang)。先貼(tie)(tie)(tie)兩(liang)面(mian)(mian)SMD，回(hui)流(liu)(liu)焊(han)(han)(han)(han)接(jie)(jie)，后插裝(zhuang)(zhuang)，波(bo)峰焊(han)(han)(han)(han) E：來料(liao)檢(jian)(jian)(jian)測 => PCB的B面(mian)(mian)絲(si)印(yin)(yin)焊(han)(han)(han)(han)膏(gao)（點貼(tie)(tie)(tie)片(pian)(pian)(pian)(pian)膠(jiao)）=> 貼(tie)(tie)(tie)片(pian)(pian)(pian)(pian) => 烘干(gan)（固(gu)(gu)化(hua)）=>回(hui)流(liu)(liu)焊(han)(han)(han)(han)接(jie)(jie) => 翻(fan)板 => PCB的A面(mian)(mian)絲(si)印(yin)(yin)焊(han)(han)(han)(han)膏(gao) => 貼(tie)(tie)(tie)片(pian)(pian)(pian)(pian) => 烘干(gan) =回(hui)流(liu)(liu)焊(han)(han)(han)(han)接(jie)(jie)1（可采(cai)用(yong)局部焊(han)(han)(han)(han)接(jie)(jie)）=> 插件 => 波(bo)峰焊(han)(han)(han)(han)2（如插裝(zhuang)(zhuang)元件少，可使(shi)用(yong)手工(gong)焊(han)(han)(han)(han)接(jie)(jie)）=> 清洗 =>檢(jian)(jian)(jian)測 => 返修A面(mian)(mian)貼(tie)(tie)(tie)裝(zhuang)(zhuang)、B面(mian)(mian)混裝(zhuang)(zhuang)。

五、雙(shuang)面(mian)組裝工藝

A：來料(liao)檢測,PCB的A面絲印焊(han)膏（點(dian)貼(tie)片(pian)(pian)膠）,貼(tie)片(pian)(pian),烘干(gan)（固化）,A面回(hui)流焊(han)接(jie)(jie),清洗,翻(fan)板;PCB的B面絲印焊(han)膏（點(dian)貼(tie)片(pian)(pian)膠）,貼(tie)片(pian)(pian),烘干(gan),回(hui)流焊(han)接(jie)(jie)（盡(jin)量僅對B面,清洗,檢測,返修）

此工(gong)藝適用于在(zai)PCB兩面均(jun)貼裝有PLCC等較(jiao)大的SMD時采。

B：來料檢測,PCB的A面(mian)絲印焊膏（點(dian)貼(tie)(tie)片膠）,貼(tie)(tie)片,烘干（固(gu)化(hua)）,A面(mian)回流焊接,清(qing)(qing)洗,翻板;PCB的B面(mian)點(dian)貼(tie)(tie)片膠,貼(tie)(tie)片,固(gu)化(hua),B面(mian)波峰焊,清(qing)(qing)洗,檢測,返修）此工藝適用于在PCB的A面(mian)回流。